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GE IC670GBI002 General Bus Interface Module
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System Integration Overview
The GE IC670GBI002 is a General Bus Interface (GBI) module designed for the IC670 / RX3i PLC platform. Its primary function is to provide a robust communication bridge between the backplane bus of the IC670 chassis and remote or auxiliary I/O networks.
From a system integration perspective, the GBI module ensures deterministic data transfer between central CPUs and distributed I/O modules, supporting scalable industrial automation networks. It is widely used in applications where multiple chassis or extended I/O systems are deployed and centralized control must maintain low latency and high reliability.
Technical Specifications
| Parameter | Description |
|---|---|
| Model Number | IC670GBI002 |
| Brand | GE / Fanuc |
| Module Type | General Bus Interface (GBI) |
| Platform Compatibility | IC670 / RX3i Series PLC |
| Function | Backplane-to-remote I/O communication |
| Bus Protocol | IC670 proprietary backplane |
| Communication Ports | RS-232 / RS-485 serial connections |
| Addressing | DIP switch configurable |
| Power Supply | Rack-powered (5 VDC logic, 24 VDC optional field supply) |
| Operating Temperature | 0°C to +60°C |
| Storage Temperature | –40°C to +85°C |
| Dimensions (H × W × D) | ≈ 110 mm × 35 mm × 120 mm |
| Weight | ≈ 0.48 kg |
| Mounting | IC670-compatible chassis slot or DIN-rail with adapter |
Applications / Use Scenarios
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Connecting multiple IC670 chassis within a distributed control network
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Serving as communication bridge between central CPU and remote I/O racks
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Scalable factory automation systems with modular IC670 expansion
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Retrofitting older RX3i systems to support additional remote I/O
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Ensuring deterministic, low-latency communication for high-speed process control
Advantages / Engineering Benefits
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Deterministic communication ensures timely data transfer across multiple racks
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Supports both RS-232 and RS-485 for flexible serial network topologies
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DIP switch configuration simplifies addressing and system setup
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Compact design fits IC670 standard backplane slots without additional hardware
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Industrial-grade construction enhances reliability in harsh environments
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Facilitates modular system expansion without redesigning core CPU programs
Technical FAQs
-
What is the primary function of IC670GBI002?
– Provides a communication bridge between backplane and remote I/O modules. -
Which PLC chassis is it compatible with?
– IC670 / RX3i series 3-slot and larger chassis. -
What serial protocols does it support?
– RS-232 and RS-485. -
How is addressing configured?
– Through DIP switches on the module. -
Is power supplied through the chassis?
– Yes, standard rack-powered 5 VDC logic, with 24 VDC optional for field devices. -
What is the maximum operating temperature?
– 60°C. -
Can multiple GBI modules be used in one network?
– Yes, supports multi-rack distributed I/O configurations. -
Is hot-swapping supported?
– No, power should be removed before insertion or removal. -
What is the typical weight?
– Approximately 0.48 kg. -
Is it suitable for industrial vibration-prone environments?
– Yes, designed with rugged construction for reliability.
Recommended Related Models
| Model Number | Description |
|---|---|
| IC670CPU310 | RX3i CPU module compatible with GBI networks |
| IC670MDL340 | Digital output module |
| IC670PWR330 | Power supply module |
| IC670CHS001 | 3-slot chassis for IC670 series |
Popular GE IC670 / RX3i Modules
| Model Number | Description |
|---|---|
| IC670CPU310 | RX3i CPU module |
| IC670MDL340 | 32-point digital output module |
| IC670MDL330 | Digital input module |
| IC670PWR330 | Power supply module |
| IC670GBI002 | General Bus Interface module (this module) |
| Company Information | ||||||||
| [email protected] | ||||||||
| Mobile | +8613666033393 | |||||||
| +8613666033393 | ||||||||
| 13666033393 | ||||||||
| Add | Room 1004, No. 62 Xiangxiu Li, Siming District, Xiamen City, Fujian Province, China | |||||||
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